专利名称：BIDIRECTIONAL AND UNIFORM COOLING
FOR MULTIPLE COMPONENTS IN ACOMPUTING DEVICE
发明人：CHEN, Chao-Jung,CHEN, Yi-Chieh,TSAI, Ming-Hung,CHEN, Jen-Mao
申请号：EP18189387.6申请日：20180816公开号：EP3531234A1公开日：20190828
专利附图：
摘要：A circuit card assembly (100) includes a circuit card (102), a plurality of
components (110) disposed on a first surface of the circuit card in a shadow arrangement,and a plurality of air-cooled heat sink structures (120) disposed on each of thecomponents. Each of the plurality of heat sink structures comprises a plurality ofimpedance zones (124) arranged in series substantially perpendicular to the airflow path(130, 132), where the plurality of impedance zones comprise a first impedance zonehaving a first air impedance, and a second impedance zone having a second air impedanceless than the first air impedance. Further, the plurality of zones in the plurality of heatsink structures are aligned so that the first impedance zone in one of the plurality of heatsink structures does not overlap with the first impedance zone in another of the pluralityof heat sink structures, relative to the airflow path.
申请人：Quanta Computer Inc.
地址：No. 188, Wenhua 2nd Road Guishan District Taoyuan City 333 TW
国籍：TW
代理机构：Winter, Brandl, Fürniss, Hübner, Röss, Kaiser, Polte - Partnerschaft mbB
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容